Current generation electronic product in high-power, high-efficiency operation, all of which might result in producing heat and impact on electronic product features, and make electronic components and abnormal, even short circuit. The heat source of overheating components will be transfer to more heating surface area and better cooling material, to reach quickly heat transferring purposes.
But the air is the impediment heat source conduction biggest factor (air K value =0.026), in order to transfer the heat source so that need select the thermal pad accordingly.
When we using various thermal conductivity material, and meet organization needed thickness and the space, there will derivative many specifications of the thermal pad and the thermal tape that will no need of using any fasteners or screws.

Modern electronic products pursue for more thin to saving time and space, however, this would increase the internal electrical components bear load.
C-cooler used the Oxygen-free copper (Germany) with Japan's protection film and adhesive. It will achieve great insulation, and it can be pasted on the heat source directly after tear out the liner, then will be show the maxima effectiveness about the OFC. ( K values more than 400)

Constantly upgrades to the development of computer, audio, video, communications, multimedia equipment, and the varied of the demand will cause the EMI(Electromagnetic Disturbance) problem.
Resolution of this problem, three methods: shielding, grounding and attenuation (absorbing.)
Of these, the composite materials include shielding and grounding such as copper/aluminum foil tape, conductive fabric tape, often used for EMI solutions.
The Omni-directional conductive tape can solve only one side of xy axis conductive problem, and make it full continuity, provides an excellent shielding effect.