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Phase-Change Thermal Interface Pads

CP-Series phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks. This low thermal resistance path maximizes heat sink performance and improves component reliability.
CP-Series material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows CP-Series pads to achieve performance superior to any other thermal interface materials.

Feature：
  1. The surface has good flow ability after the material thermal fuse, can be filled surface irregularities.
  2. Protective release liner prevents contamination of material prior to final component assembly.
  3. Demonstrated reliability through thermal cycling and accelerated age testing.
  4. Available in custom die-cut shapes, kiss-cut on rolls.
  5. It reduces the problem of the import material adhesive to the chip significantly.

Applications：
  1. Micro processor, CPU, GPU, and high heat source chip.
  2. Power modules、Power Semiconductor Devices、memory modules and NB thermal modules.
  3. Fixed the cooler on the MB North bridge、West bridge and the graphic card.
  4. Applies to all types of networking and communications products. Ex: base station、router、and hub modem system.
  5. LED backlight and lighting.
  6. All kinds of consumer products. Ex: TV、Set Top Box.
  7. All kinds of electronics, electrical products heating application.
  8. Automotive electronics、handheld electronic products、telecommunications hardware.
TYPICAL PROPERTIES
No. CP-1 CP-2 CP-3 TEST METHOD
Color Red Visual
Thickness 0.13mm 0.13mm 0.2mm ASTM D374
Carrier Non-Free Film --
Thickness tolerance ±10% --
Phase Transition
Temperature, °C		 48 ASTM D3418
Weight Loss,
125°C for 48 Hours		 <0.5% --
Thermal Conductivity    (W/mK) 2.0 4.8 5.8 ASTM D5470
Thermal Impedance @
70°C (°C-in2/W) 50Psi		 0.03 0.008 0.003 ASTM D5470
Operating Temperature
Range, °C		 (-)55 to 150 --
Volume Resistivity,
ohm-cm		 1014 ASTM D257
RoHS Compliant YES SGS
Shelf Life,months from date  of shipment 12 VOT

 

Phase-Change Thermal Insulation Pads   CP-IS series

CP-IS series is designed for one of the need for as high as possible thermal conductivity, voltage resistance and mechanical thermal insulation materials.
The PET and PI reinforcement to enhance the characteristics of the CP-IS series of tear, cut, puncture, all about these materials can be processed in the form of a sheet and die-cutting.

Features:

  1. Excellent thermal conductivity and high withstand voltage.
  2. Excellent mechanical strength and puncture resistance, easy to processing and use.
  3. CP-2 thermal phase change material is proof by verification.

 

Applications:

  1. Power supplies, UPS systems
  2. Power conversion
  3. Power semiconductor
  4. Automotive electronics
  5. Motor and engine controller
  6. High voltage-resistant products

 

Single side phase-Change Thermal Interface Pads  CP-M series

CP-M Series phase change thermal interface material is recommended for applications where rework and ease of disassembly are important. The material provides the high performance properties of typical phase change materials
with the added benefit of easy removal. It consists of a tacky, electrically non-conductive phase change film on one side of a conformable metal foil carrier. CP-M can be assembled onto a heat sink or heat spreader, leaving the metal foil exposed. The natural tack of the phase change polymer will hold the CP-M to the heat sink, while the foil layer acts as a clean interface between the component and heat sink, allowing a clean break during disassembly or rework.

Features:

  1. Increased performance at elevated temperatures

  2. Comes in free film or foil backed version for rework ability

  3. Can be die-cut and tabbed for ease of installation.

  4. No pump-out associated with thermal grease

 

Applications:

  1. Microprocessors
  2. Graphics Processors
  3. Chipsets
  4. Power Modules
  5. Power Semiconductors
  6. Memory modules
  7. LED lighting and LED TV
  8. Note book and tablet PC
  9. Heat sink thermal model
  10. Automotive electronics
  11. Handheld electronics
  12. Telecommunication hardware

 

TYPICAL PROPERTIES
No. CP-IS4 CP-IS5 CP-IS6 CP-IS7 Test Method
Color Pink Tawny Tawny Pink / Silver Visual
Thickness 0.07 0.07 0.3 0.16mm ASTM D374
Carrier 2mil PET 2mil polymide 2mil polymide 1.5mil Metal foil --
Thickness tolerance ±10% --
Phase Transition
Temperature, °C		 48 ASTM D3418
Weight Loss,
125°C for 48 Hours		 <0.5% --
Thermal Conductivity    (W/mK) 0.8 1.2 2.6 4.8
(for CP-2 material only)		 ASTM D5470
Thermal Impedance @
70°C (°C-in2/W) 50Psi		 0.48 0.26 0.06 0.013 ASTM D5470
Operating Temperature
Range, °C		 (-)55 to 150 --
Volume Resistivity,
ohm-cm		 1014 1014
(for CP-2 material only)		 ASTM D257
Voltage Breakdown (Vac) 7.7K 9K 9K -- ASTM D149
RoHS Compliant YES SGS
Shelf Life,months from date of shipment 12 VOT


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